A Ring Gyroscope With On-Chip Capacitive Stress Compensation
Author:
Affiliation:
1. Department of Electrical and Electronics Engineering, Bilkent University, Ankara, Turkey
2. Department of Electrical and Electronics Engineering, National Nanotechnology Research Center (UNAM), Bilkent University, Ankara, Turkey
Funder
Scientific and Technological Research Council of Turkey (TUBITAK) 2232 Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
http://xplorestaging.ieee.org/ielx7/84/9906516/09861651.pdf?arnumber=9861651
Reference36 articles.
1. Advanced MEMS Process for Wafer Level Hermetic Encapsulation of MEMS Devices Using SOI Cap Wafers With Vertical Feedthroughs
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4. Design of resonators for the determination of the temperature coefficients of elastic constants of monocrystalline silicon
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