Thermal properties of high-power transistors

Author:

Winkler R.H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 52 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Influence of Parasitic Capacitances and Inductances in a Power Electronic Converter on Junction Temperature of Power GaN HEMTs;2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES);2024-06-27

2. Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2 composite solder paste;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27

3. Electrothermal Characterization, TCAD Simulations, and Physical Modeling of Advanced SiGe HBTs;Nanoelectronics;2019

4. Measurement and Modeling of Thermal Behavior in InGaP/GaAs HBTs;IEEE Transactions on Electron Devices;2013-05

5. Experimental Characterization and Modeling of the Thermal Behavior of SiGe HBTs;IEEE Transactions on Electron Devices;2012-07

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