Thermal-Mechanical Process Simulation of an Advanced NCF Technology-Reference-Cited by-同舟云学术

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Thermal-Mechanical Process Simulation of an Advanced NCF Technology

Published:2009-10 Issue:4 Volume:32 Page:301-310
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Cheng Hsien-Chie,Hwang Wan-Yu,Kao Kuo Shu,Tsang Jimmy,Yang Sterling S.,An Chao-Chyun,Chang Simon M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/5261115/05261118.pdf?arnumber=5261118

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA);Current Applied Physics;2013-07

2. Multi-objective optimization of yield rate and tact time of ACF in the TFT-LCD short-bar attach process using the fuzzy dominant directed graph method;Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture;2011-09-30

3. Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-01

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