Reliability and wireability optimizations for chip placement on multichip modules
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Link
http://xplorestaging.ieee.org/ielx5/6104/30930/01435551.pdf?arnumber=1435551
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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3. Thermal placement on PCB of components including 3D ICs;IEICE Electronics Express;2020
4. Optimal placement of heat generating components at various levels of electronics packaging;Microelectronics Journal;2010-02
5. Topology optimization of heat conduction problem involving design-dependent heat load effect;Finite Elements in Analysis and Design;2008-10
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