Comparisons and Evaluations of Silicon and Wide Band Gap Devices at Cryogenic Temperature-Reference-Cited by-同舟云学术

Comparisons and Evaluations of Silicon and Wide Band Gap Devices at Cryogenic Temperature

Published:2023-03 Issue:2 Volume:59 Page:1982-1994
ISSN:0093-9994
Container-title:IEEE Transactions on Industry Applications
language:
Short-container-title:IEEE Trans. on Ind. Applicat.

Author:

Wei Yuqi¹^ORCID,Hossain Md Maksudul¹^ORCID,Mantooth H. Alan²^ORCID

Affiliation:

1. Department of Electrical Engineering, University of Arkansas, Fayetteville, RA, USA

2. Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA

Funder

NASA ULI: Development of the Cryogenic Hydrogen-Energy Electric Transport Aircraft Design Concept

University of Arkansas

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/28/10077489/09965563.pdf?arnumber=9965563

Reference30 articles.

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3. Characterization of Inductor Magnetic Cores for Cryogenic Applications

4. Performance of high-frequency high-flux magnetic cores at cryogenic temperatures;gerber;Proc IEEE Intersoc Energy Convers Eng Conf,2002

5. Comprehensive Characterization of the 4H-SiC Planar and Trench Gate MOSFETs From Cryogenic to High Temperature

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1. Review of semiconductor devices and other power electronics components at cryogenic temperature;iEnergy;2024-06

2. GaN-based cryogenic temperature power electronics for superconducting motors in cryo-electric aircraft;Superconductor Science and Technology;2023-07-31

3. Cryogenic Operation of Enhancement-Mode GaN HEMTs;2023 IEEE Workshop on Power Electronics for Aerospace Applications (PEASA);2023-07-18

4. Design and Investigation of a Metamorphic InAs Channel Inset InP HEMT for Cryogenic Low-Noise Amplifiers;IEEE Access;2023

5. A Cryogenic 3-kW GaN E-HEMT Synchronous Buck Converter;IEEE Transactions on Industrial Electronics;2023