Synergistic Effect of Nano-Silica and Micro-Silica Fillers on the Rheological and Thermal Properties of Epoxy Resins
Author:
Affiliation:
1. University of Waterloo, Waterloo, ON, Canada
2. CrosslinkTechnologyInc., Mississauga, ON, Canada
Funder
National Science and Engineering Research Council of Canada
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering
Link
http://xplorestaging.ieee.org/ielx7/28/9895356/09806302.pdf?arnumber=9806302
Reference18 articles.
1. Effects of addition of nano-scale alumina and silica fillers on thermal conductivity and dielectric strength of epoxy / alumina microcomposites
2. Mass Production of Nanocomposites Using Electrospinning
3. Influence of Filler-Polymer Interface on Performance of Silicone Nanocomposites
4. Impact of Dispersion Processes and Surfactant on Performance of Silica-Silicone Nanocomposites
5. Optimal packing research of spherical silica fillers used in epoxy molding compound
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