Synergistic effect of positive temperature coefficient and thermally conductive micro‐nano fillers on electrical and thermal properties of epoxy resin

Author:

Rahman Taqi ur1ORCID,Chen Xiangrong1,Zhang Tianyin1,Wang Qilong1,Yin Kai1,Awais Muhammad2,Paramane Ashish3

Affiliation:

1. College of Electrical Engineering Zhejiang University Hangzhou China

2. Ningbo Orient & Cables Co. Ltd Ningbo China

3. Electrical Engineering Department National Institute of Technology Silchar Assam India

Abstract

AbstractThis study investigates the effect of positive temperature coefficient (PTC) fillers, i.e., barium strontium titanate (BST‐60) and nano hexagonal boron nitride (h‐BN) fillers, on thermal and dielectric insulation properties of epoxy (EP). The electrical resistivity, DC breakdown strength, space charge, thermal conductivity, thermogravimetric analysis, and glass transition temperature (Tg) of EP composites were measured. Results indicate that, below curie temperature, the EP composites containing 0.5 and 1 wt% of BST and 5 wt% of h‐BN have superior electrical resistivity, breakdown strength, and thermal conductivity. However, above curie temperature, the EP composites containing 2 and 2.5 wt% of BST and 5 wt% of h‐BN have superior insulation properties than the pure EP and other composites. While the thermal properties of EP improve with an increase in h‐BN loading to 10 wt%, its dielectric properties are slightly compromised due to the presence of tiny defects in the composite material. It is hypothesized that the BST‐60 suppresses the negative temperature coefficient effect (NTC) of EP by regulating the electrical resistivity above the curie point, whereas nano h‐BN enhances the thermal conductivity of EP by constructing a heat dissipation path. The proposed mechanism for charge dynamics along with heat conduction‐dissipation explains the fillers' behavior at different temperatures.Highlights Analysis of epoxy composites with polydopamine‐modified BST and h‐BN fillers. PTC fillers are used to mitigate the negative temperature effect of epoxy. Optimal fillers wt% improves dielectric and thermal properties. This study shows that optimized epoxy composites can be used for packaging.

Publisher

Wiley

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3