Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array-Reference-Cited by-同舟云学术

Global coupled EM-electrical-thermal simulation and experimental validation for a spatial power combining MMIC array

Published:2002-12 Issue:12 Volume:50 Page:2820-2833
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:en
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Batty W.,Christoffersen C.E.,Yakovlev A.B.,Whitaker J.F.,Mortazawi A.,Al-Zayed A.,Ozkar M.,Ortiz S.C.,Reano R.M.,Yang K.,Katehi L.P.B.,Snowden C.M.,Steer M.B.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx5/22/24077/01098001.pdf?arnumber=1098001

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Near-Field Technologies for Multifunction Wireless Connectivity: Recent principles and applications;IEEE Antennas and Propagation Magazine;2024

2. Passive Intermodulation Distortion in Antennas;IEEE Transactions on Antennas and Propagation;2015-02

3. Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2012-10

4. Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels;IET Circuits, Devices & Systems;2012

5. Inverse Singular Value Method for Enforcing Passivity in Reduced-Order Models of Distributed Structures for Transient and Steady-State Simulation;IEEE Transactions on Microwave Theory and Techniques;2011-04