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Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels

  • Published:2012 Issue:1 Volume:6 Page:35
  • ISSN:1751-858X
  • Container-title:IET Circuits, Devices & Systems
  • language:en
  • Short-container-title:IET Circuits Devices Syst.

Author:

Priyadarshi S.,Harris T.R.,Melamed S.,Otero C.,Kriplani N.M.,Christoffersen C.E.,Manohar R.,Dooley S.R.,Davis W.R.,Franzon P.D.,Steer M.B.

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design Benefits of Hybrid Bonding for 3D Integration;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

2. Microprocessor Frequency Control Method Under Thermal and Energy Savings Constraints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-12

3. Thermal Pathfinding for 3-D ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-07

4. Thermal-Aware High-Frequency Characterization of Large-Scale Through-Silicon-Via Structures;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-06

5. Characterising thermal resistances and capacitances of GaN high‐electron‐mobility transistors through dynamic electrothermal measurements;IET Microwaves, Antennas & Propagation;2014-04
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