Author:
Priyadarshi Shivam,Davis W. Rhett,Steer Michael B.,Franzon Paul D.
Funder
Qualcomm Inc.
Semiconductor Research Corporation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
6 articles.
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2. Fighting Dark Silicon: Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2017-04
3. Physical Design Automation for 3D Chip Stacks;Proceedings of the 2016 on International Symposium on Physical Design;2016-04-03
4. Analysis, Design, and Prototyping of Temperature Resilient Clock Distribution Networks for 3-D ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2015-11
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