Physical Design Automation for 3D Chip Stacks-Reference-Cited by-同舟云学术

Physical Design Automation for 3D Chip Stacks

Published:2016-04-03 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2016 on International Symposium on Physical Design
language:
Short-container-title:

Author:

Knechtel Johann¹,Lienig Jens²

Affiliation:

1. Masdar Institute of Science and Technology, Abu Dhabi, Uae

2. Dresden University of Technology, Dresden, Germany

Funder

Mubadala

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/2872334.2872335

Reference110 articles.

1. (2014 Feb) Hybrid Memory Cube specification 2.0. [Online]: http://hybridmemorycube.org/files/SiteDownloads/20141119_HMCC_Spec2.0Release.pdf (2014 Feb) Hybrid Memory Cube specification 2.0. [Online]: http://hybridmemorycube.org/files/SiteDownloads/20141119_HMCC_Spec2.0Release.pdf

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