Novel methodology for 3D FEM modeling of wire bonding process by ball deformation reproduction-Reference-Cited by-同舟云学术

Novel methodology for 3D FEM modeling of wire bonding process by ball deformation reproduction

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Guarino L.¹,Caglio C.¹,Villa R.¹,Zullino L.¹,Cecchetto L.¹

Affiliation:

1. STMicroelectronics,Agrate Brianza (MB),Italy,20864

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758901.pdf?arnumber=9758901

Reference9 articles.

1. Advanced finite element model on Copper wire ball bonding

2. Computational modeling and optimization for wire bonding process on Cu/low-K wafers

3. Copper wire bonding process characterization and simulation;mancaleoni;Proc International Conference on Integrated Power Electronics Systems,2020

4. Dynamic Simulation for Microelectronic Packaging of Al Pad/Underlying Pad Structure during Copper Wire Bonding;tseng;Proc 9th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT),2014

5. Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding

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