Computational modeling and optimization for wire bonding process on Cu/low-K wafers
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2 articles.
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1. Novel methodology for 3D FEM modeling of wire bonding process by ball deformation reproduction;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
2. Concerns and Solutions;Copper Wire Bonding;2013-05-29