Deep Learning Modelling for Composite Properties of PCB Conductive Layers

Author:

Stoyanov Stoyan1,Bailey Chris1

Affiliation:

1. University of Greenwich,Computational Mechanics and Reliability Group, School of Computing and Mathematical Sciences,London,United Kingdom,SE10 9LS

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. An optimized hybrid finite element analyses - Artificial neural networks technique for estimating in-plane orthotropic mechanical properties of printed circuit boards;Results in Engineering;2024-09

2. Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics;Microelectronics Reliability;2024-06

3. Prediction of thermo-mechanical properties of PCB conductive layers using convolutional neural networks;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

4. Board Level Reliability Study on Large Antenna-in-Package Solutions for Automotive Radar Applications;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

5. Printed Circuit Board Assembly Modeling for Predictive Reliability Assessment;2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME);2022-10-26

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