An optimized hybrid finite element analyses - Artificial neural networks technique for estimating in-plane orthotropic mechanical properties of printed circuit boards-Reference-Cited by-同舟云学术

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An optimized hybrid finite element analyses - Artificial neural networks technique for estimating in-plane orthotropic mechanical properties of printed circuit boards

Published:2024-09 Issue: Volume:23 Page:102725
ISSN:2590-1230
Container-title:Results in Engineering
language:en
Short-container-title:Results in Engineering

Author:

Al-Dahidi Sameer^ORCID,Gharaibeh Mohammad A.,Alrbai Mohammad,Rinchi Bilal,Hijazi Ala

Publisher

Elsevier BV

Reference41 articles.

1. Determination of the orthotropic material properties of individual layers of printed circuit boards;Fuchs;Microelectron. Reliab.,2012

2. Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards;Wang;Microelectron. Reliab.,2006

3. Modal finite element analysis of PCBs and the role of material anisotropy;Kalyani,2020

4. Application of steinberg model for vibration lifetime evaluation of Sn-Ag-Cu-based solder joints in power semiconductors;Kavitha;IEEE Trans Compon Packaging Manuf Technol,2021

5. Validation of the resonalyser method: an inverse method for material identification;Lauwagie,2002

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