Author:
Lovberg Andreas,Tegehall Per-Erik,Wetter Goran,Brinkfeldt Klas,Andersson Dag
Cited by
6 articles.
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1. The role of microstructure in the thermal fatigue of solder joints;Nature Communications;2024-05-20
2. Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints;Materials;2022-07-21
4. QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Evaluation of SAC solder joint thermomechanical fatigue in different types of components;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25