BGA strip warpage induced by assembly process and the practical prediction methodology-Reference-Cited by-同舟云学术

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BGA strip warpage induced by assembly process and the practical prediction methodology

Published:2018-04 Issue: Volume: Page:
ISSN:
Container-title:2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Duca Roseanne,Luan Jing En,Hla Phone Maw,Villa Claudio Maria,Rovitto Marco

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8362775/8369858/08369877.pdf?arnumber=8369877

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Virtual Design of Experiment Methodology for Package Design Robustness;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Novel Approach To Resolve Strip Camber At Assembly Process Of Semiconductor Packaging;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

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