Author:
Machani Kashi Vishwanath,Kuechenmeister Frank,Breuer Dirk,Paul Jens
Cited by
4 articles.
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1. Thermal and Mechanical characterization of embedded PTCQ packaging test chip die;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Evaluation of Chip-Package Interaction by Means of Stress Sensors;IEEE Sensors Journal;2022-07-01
3. Design of Reliability Test Assemblies for WLCSP Solder Interconnects using Finite Element Modeling;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11
4. Mechanical BEoL Stability Investigation at Cu-Pillars under Cyclic Load;2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2021-09-15