Author:
Kelly M.,Servais G.,Diep T.,Lin D.,Twerefour S.,Shah G.
Cited by
21 articles.
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1. Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging;IEICE Transactions on Electronics;2023-10-01
2. Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging;2022 IEEE International Reliability Physics Symposium (IRPS);2022-03
3. ESD
Failure Analysis;Practical ESD Protection Design;2021-12-03
4. ESD
Testing;The ESD Handbook;2021-03-26
5. Electrostatic Discharge–Sensitive (ESDS) Devices;The ESD Control Program Handbook;2020-08-28