Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC)-Reference-Cited by-同舟云学术

Finite Element Method for System-in-Package (SiP) Technology: Thermal Analysis Using Chip Cooling Laminate Chip (CCLC)

Published:2023-01-03 Issue: Volume: Page:
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Container-title:2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM)
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Author:

Oukaira Aziz¹,Said Dhaou²,Zbitou Jamal³,Lakhssassi Ahmed¹

Affiliation:

1. Université du Québec en Outaouais,Departement of Electrical and Computer Engineering,Gatineau,Canada

2. Université de Sherbrooke,Departement of Electrical and Computer Engineering,Sherbrooke,Canada

3. University of Abdelmalek Essaadi,LABTIC, ENSA of Tangier,Tangier,Morocco

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10035563/10035540/10035652.pdf?arnumber=10035652

Reference23 articles.

1. A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces;ouafaa;SENSORS,2020

2. Foster-based Transient Thermal Analysis of SiP for Thermomechanical Studies;touati;IEEE International New Circuits and Systems Conference (NEWCAS),0

3. Thermal Analysis and Design of Electronics Systems Across Scales Using State-Space Modeling Technique

4. Simulation, Validation and FPGA Implementation of a Ring Oscillator Sensor for Thermal Management and Monitoring;aziz;Elsevier Procedia Computer Science,2019

5. A Review of Moldflow and Finite Element Analysis Simulation of Chip Scale Packaging (CSP) for Light Emitting Diode (LED)

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1. Integrated Thermal Management Strategies for 3D Chip Stacking with Through-Silicon Vias (TSV);2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET);2024-05-16

2. Efficient Thermal Management Strategies for 3D-SiP Architectures;2024 18th International Conference on Ubiquitous Information Management and Communication (IMCOM);2024-01-03

3. Analytical and Numerical Modeling of the Thermal Performance of 3D System-in-Package (SiP);2023 International Conference on Electrical, Computer and Energy Technologies (ICECET);2023-11-16

4. Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology;Electronics;2023-07-20