Thermal analysis and validation of packaging for 100W and higher GaN MMIC power amplifiers-Reference-Cited by-同舟云学术

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Thermal analysis and validation of packaging for 100W and higher GaN MMIC power amplifiers

Published:2011-04 Issue: Volume: Page:
ISSN:
Container-title:WAMICON 2011 Conference Proceedings
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Author:

Harris Mike,Wagner Brent,Tong Wusheng,Menkara Hisham,Halpern Stan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5783448/5872849/05872896.pdf?arnumber=5872896

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Transient Analysis of a 650 V/150 A GaN Power Modules With Integrated Bias Power and Gate-Drive Circuit;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

2. Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel;IEEE Transactions on Electron Devices;2024-01

3. Time scale matching of dynamically operated devices using composite thermal capacitors;Microelectronics Journal;2014-08

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