Anomalous RF Propagations of a IIIV Flip-Chip onto a CPW Substrate
Author:
Affiliation:
1. National Taiwan University,Graduate Institute of Communication Engineering,Taipei,Taiwan
2. BU3 PanelSemi Corporation,Tainan,Taiwan
3. Yuan Ze University,Department of Electrical Engineering,Taoyuan,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10439662/10439663/10439786.pdf?arnumber=10439786
Reference5 articles.
1. The flip-chip approach for millimeter wave packaging
2. Connecting Chips With More Than 100 GHz Bandwidth
3. Transmission Characteristics of finite-width conductor-backed coplanar waveguide;Tien;IEEE MTT Trans,1993
4. Resonant phenomena in conductor-backed coplanar waveguides (CBCPW's)
5. Study of Resonant Modes in Rectangular Dielectric Resonator Antenna Based on Radar Cross Section
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