A 1.28 μm2 bit-line shielded memory cell technology for 64 Mb DRAMs
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx2/147/3344/05727444.pdf?arnumber=5727444
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Optimization of process conditions for the formation of hemispherical-grained (HSG) silicon in high-density DRAM capacitor;Materials Science in Semiconductor Processing;2002-12
2. Microstructure evolution of nanometer-sized hemispherical-grained Si deposited by RTCVD;Materials Science and Engineering: C;2001-08
3. Investigation on Leakage Current Reduction of Photo‐CVD Tantalum Oxide Films Accomplished by Active Oxygen Annealing;Journal of The Electrochemical Society;1992-01-01
4. Compact sources in Japan and their intended applications (invited);Review of Scientific Instruments;1992-01
5. Oxide‐nitride storage dielectrics on smooth and rough polycrystalline silicon layers;Applied Physics Letters;1991-07-15
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