Analysis of the Influence of Vibration and Thermal Vibration Coupling on the Power Module-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Analysis of the Influence of Vibration and Thermal Vibration Coupling on the Power Module

Published:2021-08-25 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)
language:
Short-container-title:

Author:

Guan Jiajia,Zhang Chi,Chen Cai,Kang Yong

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9655996/9655997/09656042.pdf?arnumber=9656042

Reference8 articles.

1. The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies

2. Response prediction and verification for PCB with package due to thermal and random vibration coupling effects

3. Influence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Module

4. Analysis of Multilayered Power Module Packaging Behavior Under Random Vibrations

5. Modelling and analysis of vibration on power electronic module structure and application of model order reduction

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of the Degradation Mechanism of SiC MOSFET Subjected to Multiple Stresses;Micromachines;2023-07-21

2. Influence of Temperature on Bond Wire Fatigue of Gate Loops in IGBT Modules under Sinusoidal Vibration Stress;2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia);2023-05-22

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP