Response prediction and verification for PCB with package due to thermal and random vibration coupling effects-Reference-Cited by-同舟云学术

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Response prediction and verification for PCB with package due to thermal and random vibration coupling effects

Published:2009-10 Issue: Volume: Page:
ISSN:
Container-title:2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
language:
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Author:

Wang Bor-Tsuen,Hsu Fu-Xiang,Liang Xiu-Wei,Hung Chen-Hsiung,Lai Yi-Shao,Yeh Chang-Lin,Lee Ying-Chih

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5357591/5382114/05382202.pdf?arnumber=5382202

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of the Influence of Vibration and Thermal Vibration Coupling on the Power Module;2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia);2021-08-25

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