Study of the Thermomechanical Strain Induced by Current Pulses in SiC-Based Power MOSFET

Author:

Anoldo Laura,Triolo Claudia,Panarello SaverioORCID,Garesci Francesca,Russo Sebastiano,Messina Angelo AlbertoORCID,Calabretta MicheleORCID,Patane SalvatoreORCID

Funder

ECSEL JU Project PROGRESSUS

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Impact of Layout Parameter Mismatches on Short Circuit Reliability of Parallel-Connected Planar, Trench, and Double-Trench SiC MOSFETs;IEEE Transactions on Device and Materials Reliability;2024-09

2. Multiphysics simulation study of thermal stress effects in nanoscale FinFETs heterogeneously integrated with GaN high-power device on silicon substrate;Microelectronics Journal;2024-08

3. Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module Under Several Operating Condition;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

4. Fast Liquid-to-Liquid Thermal Shock: Experimental Assessment and Mechanical Model for Plastic Package;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

5. Thermography Analysis of Automotive SiC Power Modules for Reliability Assessment;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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