An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging-Reference-Cited by-同舟云学术

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An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

Published:2009-10 Issue:10 Volume:56 Page:2145-2156
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Wygant I. O.,Jamal N. S.,Lee H. J.,Nikoozadeh A.,Oralkan O.,Karaman M.,Khuri-yakub B. T.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx5/58/5306744/05306761.pdf?arnumber=5306761

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