Author:
Jia-Wei Fang ,I-Jye Lin ,Ping-Hung Yuh ,Yao-Wen Chang ,Jyh-Herng Wang
Cited by
24 articles.
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1. Physical Design Challenges in Modern Heterogeneous Integration;Proceedings of the 2024 International Symposium on Physical Design;2024-03-12
2. Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-09
3. Any-Angle Routing for Redistribution Layers in 2.5D IC Packages;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
4. Ordered Escape Routing via Assignment of Routability-Driven Detouring Paths;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04
5. Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022-12