A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits-Reference-Cited by-同舟云学术

A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits

Published:2023-11-01 Issue:21 Volume:41 Page:6741-6755
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Chang Po-Hsuan¹^ORCID,Samanta Anirban²^ORCID,Yan Peng¹^ORCID,Fu Mingye²^ORCID,Zhang Yu²,On Mehmet Berkay²^ORCID,Kumar Ankur¹^ORCID,Kang Hyungryul¹,Yi Il-Min¹^ORCID,Annabattuni Dedeepya¹,Scott David³,Patti Robert⁴,Fan Yang-Hang¹,Zhu Yuanming¹^ORCID,Palermo Samuel¹^ORCID,Yoo S. J. Ben²^ORCID

Affiliation:

1. Analog and Mixed-Signal Center, Texas A&M University, College Station, TX, USA

2. Department of Electrical and Computer Engineering, University of California, Davis, CA, USA

3. Optelligent, Costa Mesa, CA, USA

4. NHanced Semiconductors, Batavia, IL, USA

Funder

DoE UAI Consortium

DoD

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics