Energy-Efficient Optical Transceiver Circuits Enabled by 3D Heterogeneous Integration
Author:
Affiliation:
1. Texas A&M University,College Station,Texas
2. University of California, Davis,Davis
3. Optelligent,Costa Mesa,CA
4. Nhanced Semiconductors,Batavia,IL
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10543257/10543280/10544078.pdf?arnumber=10544078
Reference4 articles.
1. Direct Bond Interconnect (DBI) for fine-pitch bonding in 3D and 2.5D integrated circuits;Wang
2. A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit
3. A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits
4. Vertical Junction Silicon Microdisk Modulator with Integrated Thermal Tuner
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