Wire Bond Integrity Test Chip-Reference-Cited by-同舟云学术

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Wire Bond Integrity Test Chip

Published:1983-04 Issue: Volume: Page:
ISSN:
Container-title:21st International Reliability Physics Symposium
language:
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Author:

Blish R. C.,Parobek L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4208469/4208470/04208496.pdf?arnumber=4208496

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation;Microelectronics Reliability;2016-06

2. Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method;Journal of Electronic Packaging;2014-10-06

3. Measuring stress next to Au ball bond during high temperature aging;Microelectronics Reliability;2009-07

4. Gold-Aluminum Intermetallic Formation Kinetics;2006 IEEE International Reliability Physics Symposium Proceedings;2006-03

5. Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin;Microelectronics Reliability;2000-01

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