Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation-Reference-Cited by-同舟云学术

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation

Published:2016-06 Issue: Volume:61 Page:56-63
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chan Marvin,Tan Cher Ming,Lee Kheng Chooi,Tan Chuan Seng

Funder

Nanyang Technological University (NTU)

Infineon Technologies Asia Pacific (IFAP)

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. Technical barriers and development of Cu wirebonding in nanoelectronics device packaging;N.E.;J. Nanomater.,2012

5. Bonding wire options and their impact on product reliability;H.R.,2011

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