Author:
Merrett R P,Bryant J P,Studd R
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Modern Trends in Microelectronics Packaging Reliability Testing;Micromachines;2024-03-15
2. References;Reliability Prediction for Microelectronics;2024-02-16
3. Apparatus to investigate the insulation impedance and accelerated life-testing of neural interfaces;Journal of Neural Engineering;2018-10-31
4. Criteria for the assessment of reliability models;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1997
5. Package Reliability;Microelectronics Packaging Handbook;1997