Integration Method of Millimeter Wave Chip Cavity Passive Components Based on Metal Assisted Chemical Etching

Author:

Huang Wen1,Sun Yan1,Luo Xiang1,Kraman Mark2,Sang Lei1,Chen Xiaochen2

Affiliation:

1. Hefei University of Technology,School of Microelectronics,Hefei,China

2. University of Illinois, Urbana-Champaign,Department of Electrical and Computer Engineering,Champaign-Urbana,United States

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

IEEE

Reference7 articles.

1. Metal assisted chemical etching for high aspect ratio nanostructures: A review of characteristics and applications in photovoltaics

2. Micromachined rectangular-coaxial transmission lines

3. The study of compensative structure assisted convex and concave corner structures etching by inductively coupled plasma-reactive ion etch (ICP-RIE);lin,2015

4. Metal-Assisted Chemical Etching Method Subjected to Micro/Nano Device Fabrication[C];International Conference on Solid-State Sensors Actuators and Microsystems & Eurosensors XXXIII,2019

5. Photonic crystal membrane reflectors by magnetic field-guided metal-assisted chemical etching

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