Metal assisted chemical etching for high aspect ratio nanostructures: A review of characteristics and applications in photovoltaics
Author:
Publisher
Elsevier BV
Subject
General Materials Science
Reference81 articles.
1. High aspect ratio silicon etch: a review;Wu;J Appl Phys,2010
2. Handbook of advanced plasma processing techniques;Shul,2000
3. Dry etch damage in IIIaCV semiconductors;Hu;Microelectron Eng,1997
4. Characterization of reactive ion etching-induced damage to n-GaN surfaces using schottky diodes;Ping;J Electron Mater,1997
5. Enhanced thermoelectric performance of rough silicon nanowires;Hochbaum;Nature,2008
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