Au-Sn microsoldering on flexible circuit-Reference-Cited by-同舟云学术

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Au-Sn microsoldering on flexible circuit

Published: Issue: Volume: Page:
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Container-title:Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307)
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Author:

Tjandra J.,Wong CL.,How J.,Peana S.,Mita M.,Murakami G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/5871/15635/00723885.pdf?arnumber=723885

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-07

2. Fine-pitch, cost effective flip chip package development: TAB-BGA;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010

3. Anisotropically Conductive Adhesives/Films (ACA/ACF);Electrical Conductive Adhesives with Nanotechnologies;2009-08-14

4. Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging;Journal of Adhesion Science and Technology;2008-01

5. Characteristic study of anisotropic-conductive film for chip-on-film packaging;Microelectronics Reliability;2001-12

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