Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex-Reference-Cited by-同舟云学术

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Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex

Published:2011-07 Issue:7 Volume:1 Page:984-990
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hsieh Chin-Tang,Liao Kun-Hou,Chen Guo-Ju,Lee Chen-Mu,Lin Hung-Jan,Cheng Kai-Jen

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/5958773/05930347.pdf?arnumber=5930347

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-10

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