Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints
-
Published:2014-10
Issue:10
Volume:4
Page:1739-1744
-
ISSN:2156-3950
-
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
-
language:
-
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Lin Chih-Fan,Chen Chih-Ming,Dow Wei-Ping,Liu Hung-Hsin,Tien Ho-Chun,Lee Shih-Fu,Chen Wei-Ming
Funder
National Science Council
ChipMOS Technologies, Hsinchu, Taiwan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials