High Temperature Lightweight Heat Pipes for Solid-State Power Amplifier (SSPA) Thermal Management-Reference-Cited by-同舟云学术

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High Temperature Lightweight Heat Pipes for Solid-State Power Amplifier (SSPA) Thermal Management

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Ababneh Mohammed T.,Tarau Calin,Anderson William G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8747321/8756497/08757426.pdf?arnumber=8757426

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal performance of an embedded heat source vapor chamber in microwave solid-state power amplifier cooling;2023 IEEE 11th Asia-Pacific Conference on Antennas and Propagation (APCAP);2023-11-22

2. Sequential Switching Shunt Regulator With Improved Controller to Suppress the Influence of Double-Section Phenomenon;IEEE Journal of Emerging and Selected Topics in Power Electronics;2022-10

3. Thermal Design of GaN High Power Amplifiers;Microwave High Power High Efficiency GaN Amplifiers for Communication;2022

4. Investigation of 3D printed polymer-based heat dissipator for GaN transistors;2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe);2021-09-06

5. 3D printing for microsatellites-material requirements and recent developments;AIMS Materials Science;2020

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