Investigation of 3D printed polymer-based heat dissipator for GaN transistors
Author:
Affiliation:
1. Univ Lyon, INSA Lyon, Université Claude Bernard Lyon 1,École Centrale de Lyon, CNRS, Ampère, UMR5505,Villeurbanne,France,69621
2. Univ Lyon,INSA Lyon, CNRS, CETHIL UMR5008,Villeurbanne,France,F-69621
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9570185/9570186/09570191.pdf?arnumber=9570191
Reference17 articles.
1. A Thermal Management Design Methodology for Advanced Power Electronics Utilizing Genetic Optimization and Additive Manufacturing Techniques
2. Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
3. Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
4. Maximizing the Performance of a 3D Printed Heat Sink by Accounting for Anisotropic Thermal Conductivity During Filament Deposition
5. An investigation on 3D printing technology for power electronic converters
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