The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder-Reference-Cited by-同舟云学术

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The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Basit Munshi M.,Motalab Mohammad,Suhling Jeffrey C.,Lall Pradeep

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6882079/6892251/06892272.pdf?arnumber=6892272

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