Author:
Schultz Mark,Gaynes Michael,Parida Pritish,Chainer Timothy
Cited by
8 articles.
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1. High Performance Compliant Heat Sinks;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
2. Microprocessor Performance with Multiple Cooling Approaches;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
3. Analytical Assessment of the Effect of Thermal Interface Layer Voids on Temperature in Lid-Integral Microchannel Coldplate Cooling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-06
4. Electrical, Mechanical, and Thermal Co‐Design;Antenna‐in‐Package Technology and Applications;2020-03-06
5. On the Thermal Management of
3D
‐
ICs
: From Backside to Volumetric Heat Removal;Handbook of 3D Integration;2019-02-08