On the Thermal Management of 3D ‐ ICs : From Backside to Volumetric Heat Removal-Reference-Cited by-同舟云学术

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On the Thermal Management of 3D ‐ ICs : From Backside to Volumetric Heat Removal

Published:2019-02-08 Issue: Volume: Page:433-460
ISSN:
Container-title:Handbook of 3D Integration
language:
Short-container-title:

Author:

Brunschwiler Thomas,Schlottig Gerd,Ong Chin L.,Burg Brian,Sridhar Arvind

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/9783527697052.ch19

Reference43 articles.

1. Cramming more components onto integrated circuits, reprinted from electronics, volume 38, number 8, April 19, 1965, pp. 114 ff;Moore G.E.;IEEE Solid‐State Circuits Society Newsletter,2006

2. Toward five‐dimensional scaling: how density improves efficiency in future computers;Ruch P.;IBM Journal of Research and Development,2011

3. Design of ion‐implanted MOSFET's with very small physical dimensions;Dennard R.H.;Proceedings of the IEEE,1999

4. A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters

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