A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters-Reference-Cited by-同舟云学术

A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters

Published:2015-01 Issue:1 Volume:50 Page:258-269
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Erdmann Christophe,Lowney Donnacha,Lynam Adrian,Keady Aidan,McGrath John,Cullen Edward,Breathnach Daire,Keane Denis,Lynch Patrick,De La Torre Marites,De La Torre Ronnie,Lim Peng,Collins Anthony,Farley Brendan,Madden Liam

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/4/6998099/06932508.pdf?arnumber=6932508

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