Thermal analysis and optimization of 2.5D and 3D integrated systems with Wide I/O memory-Reference-Cited by-同舟云学术

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Thermal analysis and optimization of 2.5D and 3D integrated systems with Wide I/O memory

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
language:
Short-container-title:

Author:

Heinig Andy¹,Fischbach Robert¹,Dittrich Michael¹

Affiliation:

1. Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS, Dresden, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6882079/6892251/06892268.pdf?arnumber=6892268

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ensemble learning model for effective thermal simulation of multi-core CPUs;Integration;2024-07

2. H3DM: A High-bandwidth High-capacity Hybrid 3D Memory Design for GPUs;Proceedings of the ACM on Measurement and Analysis of Computing Systems;2024-02-16

3. Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads;2023 Design, Automation & Test in Europe Conference & Exhibition (DATE);2023-04

4. Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs;2022 IEEE International Symposium on Circuits and Systems (ISCAS);2022-05-28

5. Fast Accurate Full-Chip Dynamic Thermal Simulation with Fine Resolution Enabled by a Learning Method;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022

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