High temperature creep response of lead free solders-Reference-Cited by-同舟云学术

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High temperature creep response of lead free solders

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Fahim Abdullah,Ahmed Sudan,Chowdhury Mahmudur R.,Suhling Jeffrey C.,Lall Pradeep

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7510581/7517513/07517686.pdf?arnumber=7517686

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA);2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

2. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging;Journal of Electronic Materials;2024-03-29

3. Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging;Journal of Iron and Steel Research International;2023-08

4. Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging;Journal of Electronic Packaging;2023-07-21

5. Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints;Scientific Reports;2023-05-26

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