A novel hybrid heat sink using phase change materials for transient thermal management of electronics
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/9211/29232/01319190.pdf?arnumber=1319190
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Experimental investigation of nanoparticle enhanced polyol solid–solid phase change material aided heat sink with integrated heat pipe for electronic cooling application;Thermal Science and Engineering Progress;2023-12
2. Novel PEG/EP form-stable phase change materials with high thermal conductivity enhanced by 3D ceramics network;Ceramics International;2020-11
3. Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles;Journal of Electronic Packaging;2020-05-13
4. Heat pipe with nano enhanced-PCM for electronic cooling application;Experimental Thermal and Fluid Science;2017-02
5. Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction;Applied Thermal Engineering;2017-02
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