Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction-Reference-Cited by-同舟云学术

Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction

Published:2017-02 Issue: Volume:112 Page:143-155
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Arshad Adeel,Ali Hafiz Muhammad,Ali Muzaffar,Manzoor Shehryar

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference31 articles.

1. Active cooling of a mobile phone handset;Grimes;Appl. Therm. Eng.,2010

2. Forced convective heat transfer across a pin fin micro heat sink;Peles;Int. J. Heat Mass Transf.,2005

3. A universal performance chart for CPU cooling devices;Ng;Heat Transfer Eng.,2008

4. Thermal management of low profile electronic equipment using radial fans and heat sinks;Walsh;J. Heat Transfer,2008

5. Transient cooling of electronics using phase change material (PCM)-based heat sinks;Kandasamy;Appl. Therm. Eng.,2008

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