Concepts for embedded cooling of vertical current wide band-gap semiconductor devices-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Concepts for embedded cooling of vertical current wide band-gap semiconductor devices

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
language:
Short-container-title:

Author:

Dede Ercan M.,Zhou Feng,Joshi Shailesh N.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7983314/7991835/07992529.pdf?arnumber=7992529

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design of liquid cooling cold plate for high performance electric traction module on two-wheeler EV;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics;IEEE Transactions on Power Electronics;2022-10

3. Overview of Current Thermal Management of Automotive Power Electronics for Traction Purposes and Future Directions;IEEE Transactions on Transportation Electrification;2022-06

4. Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes;Journal of Electronic Packaging;2018-08-20

5. A review of Ga2O3materials, processing, and devices;Applied Physics Reviews;2018-03

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP