Fast and accurate thermal analysis of smartphone with dynamic power management using reduced order modeling-Reference-Cited by-同舟云学术

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Fast and accurate thermal analysis of smartphone with dynamic power management using reduced order modeling

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Krishnaswamy Sivasubramani,Jain Palkesh,Saeidi Mehdi,Kulkarni Aniket,Adhiya Ankit,Harvest Jared

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7983314/7991835/07992482.pdf?arnumber=7992482

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. SpotLight: A Hotspot-Greedy, Light-Weighted, and Automated Thermal Modeling Framework for Early Smartphone Design;2024 25th International Symposium on Quality Electronic Design (ISQED);2024-04-03

2. Thermal Modeling and Optimization of Mobile Device using modified LPV ROM;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

3. On-Chip Transient Hot Spot Detection with a Multiscale ROM in 3DIC Designs;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Thermal characteristics of silicon wafer-based TVCs (thin vapor chambers) with disk-shape using DI water;International Journal of Heat and Mass Transfer;2018-12

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